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Cleaning Solutions for
Semiconductor Test
International Test Solutions’ lines of cleaning
products are based on proprietary polymers. These polymers, combined
with abrasives in a variety of configurations and sizes, are designed to
meet the cleaning needs of the semiconductor test industry.
Wafer Level Test Products
PROBE CLEAN™
- Non Abrasive Loose Debris Removal
Technical Brief - Increased Wafer Yield
Product
Bulletin - Probe Clean on Abrasive Plate
Product
Bulletin - Probe Clean on Silicon Wafer
Data
Sheet - Insertion & Withdrawal Force Curves
PROBE
POLISH™
- Loose and Bonded Debris Removal
Technical Brief - Non-destructive On-line Probe Card Cleaning
Product
Bulletin - Probe Polish on Abrasive Plate
Product
Bulletin - Probe Polish on Silicon Wafer
Data
Sheet - Probe Polish 70 Insertion & Withdrawal Force Curves
Data
Sheet - Probe Polish 99 Insertion & Withdrawal Force Curves
PROBE
SCRUB™
- Debris Collection on Abrasive Substrate
Technical Brief - Restore Probe Performance
Product
Bulletin - Probe Scrub HT on Abrasive Plate (low temperature to 125oC
applications)
Product Bulletin -
Probe Scrub HT on Silicon Wafer (low temperature to 125oC
applications)
Product
Bulletin - Probe Scrub on Abrasive Plate (low temperature to ambient
applications)
Product
Bulletin - Probe Scrub on Silicon Wafer (low temperature to ambient
applications)
PROBE
LAP™
- Abrasive Probe Tip Cleaning
Technical Brief - Reduced
Debris Generation during Abrasive Cleaning
Product
Bulletin - Probe Lap on Abrasive Plate
PROBE
FORM™
- Reshape Probe Tips
Technical Brief - Improve Contact Resistance Stability
Product
Bulletin - Probe Form on Abrasive Plate
Product
Bulletin - Probe Form on Silicon Wafer
Data
Sheet - Insertion & Withdrawal Force Curves
Cleaning Materials for Cascade Microtech Probers
Probe Clean (CMicro P/N 134-208)
Probe Polish (CMicro P/N 134-209)
Probe Scrub (CMicro P/N 134-210)
COST MODEL - Understand the
Total Cost of Cleaning during Wafer Sort
Click here to download the Cost Model.
If you have Excel installed it should start automatically.
If not, right click here and select "save target as..." or "save link
as..."
ITS Cleaning Workshop - Probe Card Cleaning Economics and
Methodologies for High Volume Wafer Sort
Please contact International Test Solutions directly for additional details
Burn-In/Test Socket and Back-End Test Products
TEST CELL CONDITIONER (TCC)
- Extend Contactor / Test Socket Life and Improve OEE

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Conferences |
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Exhibits |
SEMICON - Korea
Jan 30 to Feb 1, 2008
Seoul, Korea
SEMICON - China
Mar 18 to 20, 2008
Shanghai, China
SEMICON - Singapore
May 5 to 7, 2008
Singapore
SWTW - 2008
Jun 8 to 11, 2008
San Diego, CA
SEMICON - West
Jul 15 to 17, 2008
San Francisco, CA
SEMICON - Taiwan
Sep 9 to 11, 2008
Taipei, Taiwan
SEMICON - Europa
Oct 7 to 9, 2008
Stuttgart, Germany
SEMICON - Japan
Dec 3 to 5, 2008
Chiba, Japan |
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