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Innovative Research
and Development
International Test Solutions works closely with
customers to
fully understand their cleaning requirements and then provide
a complete cleaning solution.
ITS Product Line
Technical Briefs
Probe Clean™
- Increased Wafer Yield
Probe
Polish™
- Non-destructive On-line Probe Card Cleaning
Probe
Scrub™
- Restore Probe Performance
Probe
Lap™
- Reduced Debris
Generation during Abrasive Cleaning
Probe Form™
- Improve Contact Resistance Stability
ITS Cleaning Workshop - "Probe
Card Cleaning Economics and Methodologies for High Volume Wafer Sort"
Please contact International Test Solutions
directly for additional details
IEEE SouthWest Test Workshop
(SWTW)
2000 -
Probe Card On-line Cleaning
2002 - Extending Probe
Card Life for Fine Pitch Probe Cards
2003 - Controlling
Contact Resistance with Probe Tip Shape and Optimized Cleaning
2004 - Extending Probe
Card Lifetime: An "Abrasive" Approach
2005 - Approach to
Control CRES Instability and Improve First Pass Yield of Bumped Devices
Awarded "Best Overall Presentation at SWTW-2005"
2006 - Novel Methodologies
for Assessing On-line Probe Process Parameters
Download the
"Probe Performance Visualization Videos" (~30MB)
Awarded "Most Inspirational Presentation at SWTW-2006"
2007 - Probe Card Cleaning “A Short Tutorial”
2007 - Control of Pad Damage Using Prober Operational Parameters
ITS Collaborative Efforts and References
(downloads are made available with author permission)
Presented at SWTW-2006 by Jan Martens, Philips Semiconductors Hamburg
Fritting: Experiences with Non-Ohmic Contact Resistance while Wafer Test
Probing
Awarded "Best Overall Presentation at SWTW-2006"
Presented at SWTW-2006 by Frederick Taber, Consultant
Maximizing the Performance of an Atypical Cantilever Probe Wire Material
European Manufacturing Test Conference (EMTC)
2006 - Extending Probe Card
Life with Tip "Refreshing" Methodologies
Download the
"Flat-Tip Shaping Video" (5MB)
2007 - Off-line
Methodologies to Assess On-line CRES Performance for Cleaning
Optimization
IEEE International Test Conference
(ITC)
2004 - The Leading Edge of Production Wafer Probe Test Technology
2007 - Wafer Probe Test Technology Tutorial
Burn-In Test Socket (BiTS) Workshop
2004 - Controlling Test Cell Contact Resistance with Non-destructive
Conditioning Practices
European IS-Test Workshop
2007 - Variations of Chuck and Cleaning Unit Surfaces when probing at
temperature
EE - Evaluation Engineering
2004 - Controlling
Contact Resistance with Probe Tip Shape and Optimized Cleaning Recipes
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Conferences |
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Exhibits |
SEMICON - Korea
Jan 30 to Feb 1, 2008
Seoul, Korea
SEMICON - China
Mar 18 to 20, 2008
Shanghai, China
SEMICON - Singapore
May 5 to 7, 2008
Singapore
SWTW - 2008
Jun 8 to 11, 2008
San Diego, CA
SEMICON - West
Jul 15 to 17, 2008
San Francisco, CA
SEMICON - Taiwan
Sep 9 to 11, 2008
Taipei, Taiwan
SEMICON - Europa
Oct 7 to 9, 2008
Stuttgart, Germany
SEMICON - Japan
Dec 3 to 5, 2008
Chiba, Japan |
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