General Cleaning Parameter Guidelines

These documents help define the parameters for using the International Test Solutions' non-destructive cleaning products on the TEL, Accretech/TSK, Electroglas, and Cascade MicroTech wafer probers.  The parameters set forth in these documents should be used as guidelines for establishing basic cleaning routines for “on-line” cleaning methods. 

Some parameters are specific to user requirements and should be set based on user intent for optimum performance of cleaning regiments. User parameters may vary with contact surface material, probe tip shape and/or material and may also affect the frequency of cleaning.  In general, probe card cleaning frequency and number of cleaning insertions varies according to the specific testing environment. 

ITS Cleaning Material Guidelines for TEL Probers
  TEL P8, P8XL, and P12XL (revised documentation)

ITS Cleaning Material Guidelines for Accretech/TSK Probers
  APM-90, UF-200, and UF-300 (revised documentation)
  UF-3000 (revised documentation on zonal cleaning will be available soon)

ITS Cleaning Material Guidelines for Electroglas Probers with EG Commander
  EG-4080 and EG-4090 (revised documentation)

ITS Cleaning Material Guidelines for Cascade MicroTech Probers
  Probe Clean (CMicro P/N 134-208)
  Probe Polish (CMicro P/N 134-209)
  Probe Scrub (CMicro P/N 134-210)

Please Note - these documents are continuously being updated to reflect the most recent prober software revisions.

Additional documents for probe card analyzers, reshaping operations, and recommended practices for specific probe card applications are available directly from International Test Solutions.