Increase Yield, Improve OEE,
and Extend Contactor Life
 

TEST CELL CONDITIONER (TCC)
Test Cell Conditioner (TCC) is a unique multilayered “surrogate” package designed to fit any IC burn-in/test socket and remove all loose debris as well as embedded oxides from the contacts and test socket.  The attractive atomic forces of the polymer collect debris and containing lead-tin solder particulates.  Regularly scheduled cleaning operations are critical to control contact resistance and maximize contactor electrical performance.  

To maximize Overall Equipment Effectiveness (OEE), the "surrogate” IC chip form-factor facilitates frequent on-line test cell conditioning without the need for a “set-up break” requiring equipment downtime.  The Test Cell Conditioner uses a highly cross-linked, non-corrosive polymer that has an operating temperature range of -50^oC to +200^oC.  Use of the TCC does not impart shear forces or lateral loads on the even the most fragile and delicate contactors.    Debris and contaminants are effectively removed without the risk of damage to the contactors, base metal, or surface plating; thereby, maximizing socket life and test throughput.