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Improve Your Yields Through
Innovation
International Test Solutions
provides non-destructive probe card cleaning products used by semiconductor
manufacturers to remove debris
and contaminants generated during wafer level and burn-in/test socket testing. By removing loose debris and adherent contaminants in-line, the
quality of the testing data is improved, the test equipment downtime is
reduced, throughput is increased and manufacturing yields are improved.
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Opening of Asia Branch Office
Announced
International
Test Solutions - Taiwan located in Zhubei City, Taiwan, will bolster
our local customer service
and technical support infrastructure in Taiwan and China.
Learn more .... |
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Asia Applications
Manager Appointed
Danny Chiu has been appointed as the Applications
Manager for Asia to strengthen applications support in
Taiwan and China.
Learn more .... |
Non-destructive probe card cleaning and probe needle cleaning products for wafer level test applications ...
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PROBE CLEAN™
Removes Loose Debris From Probe Tips
Probe Clean™
is a unique highly cross-linked polymeric probe needle cleaning material
that is non-conductive, non-corrosive material that removes
and traps the loose debris that accumulates on the probe
tips and shaft.
Learn more .... |
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PROBE POLISH™
Non-destructively Maintains High Wafer Yield
Probe Polish™
combines the attractive forces of
Probe Clean™
with uniformly and spatially distributed abrasive particles
for the added benefit of removing embedded contaminants
during probe needle cleaning.
Learn more .... |
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PROBE SCRUB™
Restores Performance and Removes Bonded Debris
Probe Scrub™
is a multilayer probe card cleaning medium developed for collecting
particulates and debris that accumulate on probes during
wafer sort and effectively removing "weld nuggets"
from the probe tip contact surface.
Learn more .... |
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Precision abrasive products
for probe card cleaning and probe tip "reforming" and
shaping ...
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PROBE
LAP™
Precision Lapping Film for Probe Needle Cleaning
Probe Lap™
is a precision lapping film developed for on-line
probe needle cleaning to impart a proper contact surface finish with
significantly reduced debris generation and provide
consistent contaminant removal across a wide temperature
range (ambient up to 125oC).
Learn more .... |
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PROBE FORM™
Reshapes Probes for Stable Contact Resistance
Probe Form™
was
developed for cantilevered probe technologies to provide
a cost effective method of uniformly “reforming” a flat
probe tip into a smooth, radius shape.
Learn more .... |
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Non-destructive cleaning products for burn-in/test socket
applications ...
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TEST CELL CONDITIONER (TCC)
Collects Loose Debris and Removes Adherent Contaminants From
Test Sockets and Contactors
Test Cell
Conditioner (TCC)
is a unique multilayered “surrogate” package form-factor
designed to fit any IC burn-in/test socket and remove all
loose debris and embedded oxides from the contacts and test
socket.
Learn more .... |
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Conferences |
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Exhibits |
SEMICON - Korea
Jan 30 to Feb 1, 2008
Seoul, Korea
SEMICON - China
Mar 18 to 20, 2008
Shanghai, China
SEMICON - Singapore
May 5 to 7, 2008
Singapore
SWTW - 2008
Jun 8 to 11, 2008
San Diego, CA
SEMICON - West
Jul 15 to 17, 2008
San Francisco, CA
SEMICON - Taiwan
Sep 9 to 11, 2008
Taipei, Taiwan
SEMICON - Europa
Oct 7 to 9, 2008
Stuttgart, Germany
SEMICON - Japan
Dec 3 to 5, 2008
Chiba, Japan |
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